| 摘要 |
PURPOSE:To improve a thermal depositing property, size stability and solderability by making a heat-proof polymer film which does not melt, soften and drift at a specific temperature, a thin layer of a metal or the like and a metal sticking film, having specific melting point and softening point en bloc as a sealing member. CONSTITUTION:A heat-proof polymer film 71 shall never deform, soften and drift at least at any temperature below 180 deg.C. As the film satisfying said requirements, a resin film of tetrafluoride ethylene group of various kinds and poly-4-methyl-pentane-1 are used. For a metal sticking film 73, resin of a polyproplylene group and a polyamide group having a melting point or a softening point above 140 deg.C is used. And, since the metal sticking resin 73 has no adhesiveness to the heat-proof polymer film 71, a thin layer 72 of a nonconductive metal or a metal oxide is formed on both surfaces of said heat- proof polymer film 71 by vacuum evaporation or spattering. |
