| 摘要 |
<p>A focal plane array (FPA) mounted in an imbalanced configuration including several layers of materials with differing thermal expansion coefficients (TECs), moduli of elasticity, and thicknesses to maintain surface planarity and improve the reliability of the FPA during thermal cycling and excursions. An optical substrate is coupled to a multiplexer through an array of indium bumps. The typical TEC mismatch between the optical substrate and the multiplexer is eliminated by forcing the multiplexer to exhibit an effective TEC equal to that of the optical substrate by particularly selecting the types of materials used and the thicknesses of the individual layers of the composite structure. Consequently, undesirable deflections and distortion of the multiplexer and the indium bumps are minimized, thereby substantially improving FPA reliability. <IMAGE></p> |
