发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To allow a cover to be securely installed on a case and thereby to prevent synthetic resin from leaking out of the case and an auxiliary electrode terminal from inclination by a method wherein a number of ribs are provided on the rear side of the cover attached by the synthetic resin into an opening in the case and provided with a hole for the insertion of an external electrode terminal. CONSTITUTION:An insulating substrate 14, electrode terminals 6-11, and a semiconductor chip 3 are soldered in that order to a base board 2. Next, the semiconductor chip 3 is connected by an aluminum wire 12 to the electrode terminals 6-11. A process follows wherein a case 1 is bonded to the base board 2, gel 13 and then synthetic resin 4 is injected into the case 1, and a cover 21 is attached by the synthetic resin 4 into an opening in the case 1. During this process, the synthetic resin 4 is caused to harden in a high-temperature oven. The hardening process may be accomplished with the cover 21 attached tightly to the case 1 because ribs 22 installed for reinforcement on the rear side of the cover 21 protects the cover 21 from warp outward.</p>
申请公布号 JPS6358860(A) 申请公布日期 1988.03.14
申请号 JP19860204218 申请日期 1986.08.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 ARAI NORIYOSHI;TAKAGI YOSHIO
分类号 H01L25/07;H01L23/28;H01L25/04;H01L25/18 主分类号 H01L25/07
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