METHOD OF SOLDERING FLAT PACK IC ON PRINTED BOARD,申请号JP19870176472-传众专利搜索

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发明名称	METHOD OF SOLDERING FLAT PACK IC ON PRINTED BOARD
摘要
申请公布号	JPS6354798(A)	申请公布日期	1988.03.09
申请号	JP19870176472	申请日期	1987.07.15
申请人	JAPAN RANPU KK	发明人	HAYAKAWA HIROKI;ONODA KAZUO
分类号	H05K3/34;B23K1/00	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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