| 摘要 |
PURPOSE:To permit treatment in a wafer state before the completion of a wafer by laminating coil conductors and thin magnetic film on a magnetic substrate, forming a magnetically discontinuous part to the position furthest from the magnetic substrate in the direction approximately orthogonal with the substrate plane and using the discontinuous part as a working gap. CONSTITUTION:The spiral coil conductors 3 having plural turns and an electrode part 4 in continuation therewith are formed via an insulating film consisting of SiO2, etc., on the substrate surface 1a of the magnetic substrate 1. An oxide magnetic substrate consisting of Mn-Zn ferrite or Ni-Zn ferrite, etc., is used as the magnetic substrate 1. The coil conductors 3 are coated with the resin layer 5 consisting of an insulating material so as to be insulated from the thin magnetic film and are formed to have a curved sectional shape to control the shape of the thin magnetic film to be laminated thereon. A notch having a cut face 6a in the direction orthogonal with the substrate surface 1a and a cut face 6b parallel therewith are formed to the resin layer 5 near the peak part furthest from the magnetic substrate 1 to control the track width Tw of a head by the width thereof. Advantages of the wafer process are, therefore, best utilized and the productivity and working accuracy are remarkably improved. |
