DEVICE FOR APPLYING A FIXING MEDIUM TO ELECTRONIC COMPONENTS, MORE PARTICULARLY TO CHIP-TYPE COMPONENTS

摘要

A device for applying a fixing medium to electronic chip-type components, comprising a container with a number of stamps arranged in one row and displaceable in vertical direction. Each of these stamps consists of a stamp pin which is identical for all stamps, and an exchangeable attachment with a stamp head adapted to the components. The container is closed on the upper side by a cover plate provided with holes, on which exchangeable and displaceable supporting plates are mounted by means of magnets, each supporting plate comprising several openings adapted to the components. The cover plate and the supporting plates have guides and positioning means for positioning the supporting plates with respect to the stamps.