IC lead retaining mechanism in IC package carrier

摘要

In a carrier adapted for a flat IC package with a plurality of laterally projecting IC leads and comprising a carrier substrate having an IC package accommodation section formed on the upper central surface thereof and also having a plurality of partition walls formed about the IC package accommodation section so as to project upwardly from the upper surface of the carrier substrate and define between the adjacent partition walls IC lead receiving grooves for receiving the IC leads therein and supporting the IC leads on the bottoms thereof, an IC lead retainer provided at one end with a flexible thin hinge connected integrally to one end of the carrier substrate for permitting the IC lead retainer to be rotated toward and away from the upper surface of the carrier substrate and retaining claws for retaining the IC lead retainer rotated toward the upper surface of the carrier substrate in a state of being laid down against the upper surface of the carrier substrate. The IC leads of the IC package accommodated within the IC package accommodation section are retained between the IC lead retainer and the carrier substrate.