| 摘要 |
PURPOSE:To obtain an optical coupling device, which can drive a semiconductor laser element at a high frequency without imparing the cooling ability of a cooling element, by providing electric interconnection between a chip carrier and a package by using a heat insulating material, on the surface of which conductive metal is plated. CONSTITUTION:A semiconductor laser element 1 is fixed on a chip carrier 2. Solder 4 is applied around an optical fiber 3. The tip of the optical fiber 3 is aligned with the axis of the light emitting part of the semiconductor element so as to face the light emitting part. The optical fiber 3 is fixed on the chip carriers 2. Thus a laser coupling part is formed. Interconnection between an input terminal B8b and the chip carrier 2 is performed by using a gold-plated ceramic member 11. Therefore, the inductance becomes very small. The semiconductor laser element 1 can be driven through an input terminal A8a and the input terminal B8b at a high frequency. Meanwhile, heat insulation between a package 5 and the chip carrier 2 is kept at the same degree as a conventional device. Therefore the cooling ability of a cooling element 7 is not impaired. |
