发明名称 LAMINATO MODELLABILE A CALDO E PROCEDIMENTO PER MODELLARLO
摘要 <p>A heat-moldable laminate comprising at least one thermoplastic resin layer, at least one fiber reinforced cured thermosetting resin layer, and at least one slippage layer interposed therebetween and bonding the resin layers, said slippage layer comprising a thermoplastic resin and said slippage layer being capable of being molten at lower temperatures than the moldable temperature of the thermoplastic resin layer, and a process for molding the heat-moldable laminate to produce a molded article having excellent strength and rigidity is disclosed.</p>
申请公布号 IT1188896(B) 申请公布日期 1988.01.28
申请号 IT19800047685 申请日期 1980.01.24
申请人 TOHO BESLON CO LTD 发明人 KOZO YAMADA;TAKAYUKI TANAKA
分类号 B29C51/14;B29C70/08;B32B27/08;(IPC1-7):B29C/ 主分类号 B29C51/14
代理机构 代理人
主权项
地址