COMPOSITE MATERIAL AND METHOD OF MANUFACTURING IT

摘要

To improve, in particular, the matching of the thermal coefficients of expansion of substrate material for power semiconductors to the thermal expansion behaviour of silicon, a composite material made of metallic and nonmetallic components contains between 20 and 80% by volume of copper and/or molybdenum, the remainder being at least one nonmetallic component. Borosilicate glass, alkali-free hard glass, quartz glass and beta -eucryptite have proved particularly suitable as nonmetallic component. The composite material can advantageously be produced by powder metallurgy methods. A final moulding of the sintered compacts, preferably by extrusion, results in an anisotropic expansion behaviour and in anisotropy of the electrical and thermal conductivity of the composite material.