| 摘要 |
<p>A heat sink for adhesive attachment to an integrated circuit package has a base plate (2) with gapped areas dividing the plate into sectors. A series of radial fin elements (5) extend from the base plate except at the gapped areas where a bridging fin (5w) element spans the gap (10) to effectively help reduce the stresses caused by heat cycling and permit the adhesive bond to be relatively undisturbed.</p> |
