Epoxy resin composition for encapsulation of semi-conductor device

摘要

An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule; (b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%; (c) 1.2 to 40 parts by weight of a polyvinyl acetal compound; (d) 0.8 to 30 parts by weight of a silicone oil; and (e) 4 to 80 parts by weight of a rubber-modified phenolic resin. The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.