| 摘要 |
<p>A method of manufacturing printed circuit boards includes injection molding a polymer component which may include a substrate (10) for a printed circuit, forming circuit runs (12, 14) and circuit pads (16, 18, 20, 22) on the substrate with conductive adhesive, placing circuit components (24, 26) onto the circuit pads and curing the conductive adhesive. The adhesive may be silkscreened onto the polymer substrate. Thise process obviates the need for the large number of expensive manufacturing steps necessary to produce conventional etched fiberglass printed circuit boards.</p> |
