发明名称 HEAT PIPE COOLER FOR SEMICONDUCTOR AND MANUFACTURE THEREOF
摘要 PURPOSE:To prevent the transfer of a potential from a thyristor to a heat sink part, by connecting a heat pipe part, in which a fin is inserted and which forms the heat sink part, and a heat pipe part, which is inserted in a metal block and forms an endothermic part, through an electrically insulating film pipe, and forming each heat pipe. CONSTITUTION:A fin is inserted in each heat pipe 1 and a heat skink is formed. A heat pipe 1' is inserted in a metal block 3 and forms an endothermic part. The heat pipe 1 and the heat pipe 1' are connected through an electric insulating pipe 8. V shaped grooves are formed in the inner surface of the pipe 1. The upper end part of the pipe is formed in a semi-spherical shape, and a nozzle 6 is formed at the tip. After actuating liqiid 10 is supplied, the nozzle 6 is sealed. Grooves having a hollow part 12 are provided in an opening part 11 and the deep place in the inner surface of the pipe 1'. The heat dispersion property and the endothermic property are improved by these grooves. Then, only heat is conducted to the heat sink part. The heat sink part is electrically insulated. Thus the risk of electric shock can be prevented.
申请公布号 JPS62293655(A) 申请公布日期 1987.12.21
申请号 JP19860136719 申请日期 1986.06.12
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 MURASE TAKASHI;TANAKA SUEMI
分类号 F28D15/02;H01L23/427;H01L23/46 主分类号 F28D15/02
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