发明名称 HIGH FREQUENCY BONDER
摘要 PURPOSE:To correctly mount a small sheet at the predetermined position of a large sheet at all times by a method wherein the small sheet is mounted in a recess, which is formed by a form electrode having a top surface with nearly the same size as that of the small sheet and a vertically movable frame, which is provided around the form electrode and mounted in such a manner as to protrude beyond the top surface of the form electrode. CONSTITUTION:A mark 12 equipped with a synthetic resin backing material 16 is mounted with the backing material upward on a form electrode 17 surrounded by a vertically movable frame 18. Next, a mat 11 produced by sticking piles 14 into a fabric base 13 is positioned with the piles downward by an edge part 22 on a base table 15. The positioned mat 11 is seated on the mark 12. As a result, the frame 18, on which the mat 11 is mounted, lowers itself by the own weight of the mat 11, while being supported by springs 19, until the frame 18 becomes flush with the mark 12 mounted on the form electrode 17 or the state, in which the mark 12 abuts against the mat 11, is realized. After that, a pressing electrode 21 is lowered so as to pinchingly press the mark 12 and the mat 11 between the form electrode 17 and the pressing electrode 21.
申请公布号 JPS62284728(A) 申请公布日期 1987.12.10
申请号 JP19860128520 申请日期 1986.06.03
申请人 YAMATO:KK 发明人 YAMADA KOHEI
分类号 B29C65/04;B29L31/58 主分类号 B29C65/04
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