发明名称 DRY-ETCHING APPARATUS FOR WORKING WAFER
摘要 PURPOSE:To substantially decrease intervals between monitoring operations for improving the monitoring accuracy, by temporarily storing data collected during working of a wafer in a main memory and restoring the data in an auxiliary memory during transportation of the wafer when the wafer working process is interrupted. CONSTITUTION:A monitor data is fetched from a wafer dry etching device 1 into a computer 2 having a main memory 21 and an auxiliary memory 5. The data is displayed by a CRT 4 according to a monitor instruction given from a key board 3. Data monitored during working of a wafer is stored by the memory 21 instead of the memory 5 because the memory 21 can operate more rapidly than the memory 5, and the data stored in the memory 21 is restored in the memory 5 during transportation of the wafer. In this manner, intervals between monitoring operations can be decreased substantially and, therefore, the monitoring accuracy can be improved.
申请公布号 JPS62279635(A) 申请公布日期 1987.12.04
申请号 JP19860121111 申请日期 1986.05.28
申请人 HITACHI LTD;HITACHI ENG CO LTD 发明人 SHIOIRI YOSHITAKA;SAKAMOTO KOJI;HAKUTA MAKOTO;OKABE TSUTOMU
分类号 H01L21/302;G06F12/00 主分类号 H01L21/302
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