Sealing glass composition with lead calcium titanate filler

摘要

A sealing glass composition suitable for sealing members in semiconductor devices at a temperature below about 450 DEG C. for a short time and a comparatively low thermal expansion coefficient of about 33-48x10-7/ DEG C. matching with semiconductors. The sealing glass composition comprises 50-80 vol % solder glass powder and 20-50 vol % filler powder of lead calcium titanate represented by (Pb1-mCam)TiO3 where 0