发明名称 MANUFACTURE OF DIELECTRIC ISOLATION SUBSTRATE
摘要 PURPOSE:To reduce an edge-sagging phenomenon during finishing polishing, to eliminate the error of thickness in a substrate and to form an element island having a uniform thickness by shaping an insulating film functioning as a polishing stopper on finishing polishing to the outer circumference of the substrate. CONSTITUTION:V-shaped grooves 16 for isolating elements are formed to the surface of a substrate 11 while an inverted trapezoid groove 17, the bottom of which has a flat surface, is shaped to the outer circumference of the substrate. An insulating film 18 for isolating the elements and a supporter layer 19 are formed onto the whole surface of the substrate containing the grooves in succession. The substrate 11 is polished and removed until the bottoms of said V-shaped grooves are exposed from the substrate surface side on the reverse side of the supporter layer 19. The insulating film 18 on the bottoms of the inverted trapezoid grooves 17 functions as a polishing stopper on the polishing. Accordingly, an edge-sagging phenomenon which has been observed during finishing polishing can be reduced, and the error of thickness in the substrate due to dispersion in a pre-process can be corrected, thus forming element islands having auniform thickness extending over the whole substrate and high accuracy.
申请公布号 JPS62271446(A) 申请公布日期 1987.11.25
申请号 JP19860113451 申请日期 1986.05.20
申请人 OKI ELECTRIC IND CO LTD 发明人 MATSUOKA SUSUMU
分类号 H01L21/762;H01L21/76 主分类号 H01L21/762
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