| 摘要 |
<p>PURPOSE:To perform completely and reliably the unsealing of a semiconductor resinsealed package by the use of chemicals by a method wherein a heat treatment process sufficient for modifying the resin surface so as to have a chemical resistance is adopted before the unsealing. CONSTITUTION:A semiconductor resin-sealed package, wherein a lead frame with a semiconductor die placed thereon is resin-sealed, is unsealed by the use of chemicals. In that case, a heat treatment process 1, wherein the resin surface is modified until it has a chemical resistance, is provided before the unsealing. The conditions of the heat treatment for causing the resin surface to have an adequate resistance to the chemicals are enough at 200 deg.C and 168H. Thereby, the unsealing of the semiconductor resin-sealed package is performed safely and reliably by the use of chemicals.</p> |
