| 摘要 |
PURPOSE:A polyamide resin composition having extremely improved low water absorption properties, low warpage deformation properties and low degree of shrinkage of molding, obtained by blending polytetramethyleneadipamide with a specific granular thermosetting resin and an inorganic filler. CONSTITUTION:(A) 30-97wt% polytetramethyleneadipamide is blended with (B) 3-70wt% granular thermosetting resin containing >=80wt% particles having 1-100mum particle diameters, preferably a phenolic resin containing methylol group, having 1wt% weight loss starting temperature of thermogravimetry (10 deg.C/min rate of heating) in a range of 330-550 deg.C and (C) 0-72wt% inorganic filler, preferably glass fibers in fiber or whisker state, having >=0.5mm average length in a weight ratio of the component A/(B+C) of 30/70-84/16 and a weight ratio of the component A/B/C of 30-89/3-62/8-67. |
