发明名称 FORMATION OF CONDUCTOR PASSAGE
摘要 PURPOSE:To reduce the man-hours required for the formation of a conductor passage by closely attaching a metallic sheet or film to an insulating substrate, machining the insulating substrate with laser, and simultaneously depositing a vaporized or molten metal on the machined part. CONSTITUTION:The metallic sheet 2 is closely attached to one surface of the insulating substrate 1. A laser beam 3 condensed by a lens 4 is then irradiated on the requisite part of the substrate 1 from the opposite side of the metallic sheet 2. A through-hole is formed at the requisite part of the substrate 1 by the irradiation, and the metallic sheet 2 is melted and vaporized by the laser beam 3 passing through the through-hole. When the melted or vaporized metal passes through the through-hole and is spouted from the hole, the metal is deposited on the inner surface of the through-hole to form an electrically conductive layer 5. Accordingly, the necessary conductor passage can be easily formed with less man-hours.
申请公布号 JPS62218588(A) 申请公布日期 1987.09.25
申请号 JP19860059318 申请日期 1986.03.19
申请人 TOSHIBA CORP 发明人 MORITA NOBORU;ISHIDA SHUICHI
分类号 C23F4/04 主分类号 C23F4/04
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