| 摘要 |
PURPOSE:To prevent the breakdown of a spherical component by arranging a laser oscillator and rotatable polyhedron reflection mirror corresponding to the solder junction part of the lead of a flat lead package and by melting locally the solder junction part of the whole lead. CONSTITUTION:A laser oscillator 3 is provided corresponding to each side of the FLP 1 packaged on a print circuit board and the polyhedron reflection mirror 4 driven by rotation independently is arranged as well corresponding to the lead 2 of each side. The solder of the junction part of whole side is locally melted by locating the optical axis composed of the laser oscillator 3 and reflection mirror 4 to the solder junction part of the lead 2 by setting the respective laser output and projection time of the laser oscillator 3 corresponding to the state of the solder junction part of each lead 2. The thermal breakdown of the spherical component of FLP 1 of the above of the print circuit board can be prevented due to the laser beam energy being given to the junction part directly locally. |
