| 摘要 |
PURPOSE:To measure film thickness of an electrolytically plated layer continuously and easily with high accuracy, by converting into the film thickness a change of a value of electric resistance of a conductive member established in the same non-electrolitic plating environment as an electrolytically-plated part. CONSTITUTION:A metallic wire W is pinched at a top portion to a clamp 7 made of teflon, etc. located in a bucket frame 6 through an insulating sheath 8 such as a vinyl tube. A metallic-wire monitor is put in the same environment as a substrate during the course of the non-electrolytic plating and undergoes the same treatment process as the substrate. After immersion of a bucket 1 in electrolytic-plating solution, a clip 11 is placed between both ends of the metallic wire and thus, a change in the value of electric resistance of the metallic wire occompanying depositing of plated material thereafter can be identified continuously.
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