| 摘要 |
PURPOSE:To set the optimum conditions of dropping easily, and to reduce the quantity of a photo-resist while equalizing film thickness by using an ultrasonic spray nozzle as a nozzle for dropping the resist and moving the ultrasonic spray nozzle in the radial direction just above a semiconductor wafer. CONSTITUTION:An ultrasonic spray nozzle 3 atomizing and dropping a photo- resist 3 is hung from a moving mechanism 7 at a position just above a semiconductor wafer 2, and the nozzle 3 is mounted movably up to a distance longer than the radius of a wafer 2 in the peripheral direction from the center of rotation of the wafer 2. The wafer 2 is sucked to a spinning chuck 1 for a treating cup 4, and the wafer 2 is turned and the resist is injected, shifting the nozzle 3 in the radial direction from the center of the wafer 2 by the mechanism 7 and the resist is applied uniformly onto the whole surface of the wafer 2. The optimum conditions of dropping are set, and the quantity of the resist is reduced.
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