| 摘要 |
PURPOSE:To accurately control the etching of a printed circuit board, electronic parts or the like by using plural samples made of the same material as the material to be etched and different from each other in thickness by a certain extent when the printed circuit board or the like is etched. CONSTITUTION:When a printed circuit board or the like is chemically etched to form a prescribed pattern, plural films made of the same metal as the metal to be etched and different from each other in thickness by 2 mum within the range of 14-28mum, e.g., copper films 11 are used fate the films 11 are adhered to an unetchable alignment plate 10 such as polyethylene film with an adhesive 12. The metal to be etched may be Cu, a Cu alloy, Fe, an Fe-Ni alloy, stainless steel, Zn, steel, Ni, an Ni-Cr alloy, an Ni-P alloy, an Ni-B alloy or Al. The rate of etching of the printed circuit board or the like can be accurately judged and controlled according to the etched state of each of the copper films 11 etched, simultaneously with the etching of the board.
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