| 摘要 |
PURPOSE:To improve packaging density, and to complete a function by also projecting a lead to at least one surface of upper and lower surfaces besides the surface of a resin seal body. CONSTITUTION:A semiconductor element 1 section is sealed by a resin sealing body 14 through resin-seal molding, and tie-bar 12b is cut off. Consequently, a resin-seal semiconductor device in which leads 12c are protruded from both side surfaces of the resin sealing body 14, leads 12d are projected from an upper surface and leads 12e are protruded from a lower surface is manufactured. Separate pads are connected by connecting the leads 12d projected from the upper surface by connecting wires on the upper surface of the semiconductor element 1. Accordingly, other electronic parts are connected to the leads 12d or 12e from the upper surface or the lower surface, thus increasing packaging density, then improving the function and performance of the semiconductor element. |
