PHOTORESIST COMPOSITION

摘要

A photoresist composition is disclosed which is a mixture of a photoactive compound and an alkali soluble resin binder comprises of an unsaturated dicarboxylic acid esterified polymeric material, such as a phenolic resin containing a plurality of acid esterifiable groups esterified with an unsaturated dicarboxylic acid anhydride having the formula wherein R1 and R2 are independently selected from hydrogen and alkyl groups containing 1 to 3 carbon atoms, R3 and R4 are alkylene groups containing 1 to 3 carbon atoms and x and y are either 0 or 1.