COPPER FINE WIRE FOR BONDING

摘要

PURPOSE:To make bonding in manufacture of high integrated circuit semiconductor, etc., highly efficient by incorporating trace amounts of Mg to a pure-copper fine wire. CONSTITUTION:The copper fine wire for bonding is constituted of a composition in which 0.0001-0.028wt% Mg is incorporated to pure Cu of >=99.99wt% purity. Owing to the above composition, bonding can be performed under low bonding load without breaking an insulating layer. On application of this copper fine wire, a highly efficient bonding similar to that by the use of Au fine wires can be performed by use of inexpensive copper wires in manufacture of high integrated circuit semiconductor.