发明名称 MANUFACTURE OF LEAD FRAME AND SEMICONDUCTOR DEVICE USING IT
摘要 PURPOSE:To standardize a lead fame to realize a large decrease in cost, by connecting pointed-end parts of inner lead formed in the lead frame so that they can be cut at their connection parts. CONSTITUTION:A lead frame 11 comprises inner leads 15 inside a virtual line A and outer leads 14. At least two pointed-end parts of the inner leads 15 are connected at connection parts 17. Then, the connection parts 17 of the inner leads 15, when they are mounted, are cut so that they have a short-distance relation with the bonding pad position of a chip mounted on a tap 13. Thereafter, the chip is fixed on the tab 13 of the lead frame 11 to perform wire bonding. Thus, the lead frame 11 is standardized to realize a large decrease in cost.
申请公布号 JPS62123750(A) 申请公布日期 1987.06.05
申请号 JP19850262421 申请日期 1985.11.25
申请人 HITACHI LTD 发明人 SHIMIZU KAZUO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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