| 摘要 |
PURPOSE:To carry out flat coating without being affected by the ruggedness on the surface to be coated by rotating a substrate to be coated and exerting a force on a fluid material on the surface to be coated to separate the material from the surface. CONSTITUTION:When a fluid material such as a resist is coated on the surface of a substrate to be coated such as wafers, an appropriate amt. of the resist is dripped on the wafer 2, a chuck 15 is rotated by a motor 14, and the wafer 2 is rotated. Then a driving shaft 10 is rotated while keeping the planar movement of the wafer 2 to rotate a rotary disk 11. Consequently, the chuck 15 is revolved around the driving shaft 10 while being rotated on its axis. Moreover, a disk 17 is turned to an angle of 90 deg. to incline the supporting rod 12 of the chuck 15, then the chuck 15 is rotated at high speed, and the resist 4 is flattened by the gravity in the direction to separate the resist from the surface of the wafer 2. Flat coating can be obtained regardless of the ruggedness on the surface.
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