发明名称 |
High heat conductive insulated substrate and method of manufacturing the same. |
摘要 |
<p>A high heat conductive insulated substrate comprising a substrate of which heat conductivity is not less than 50 W/m.k, and a high heat conductive insulating layer coated on the substrate; and a method of producing a high heat conductive insulated substrate characterized in that an insulating layer is formed on a substrate by applying DC voltage and RF power to the substrate and providing magnetic field parallel to the surface of the substrate. …<??>The insulated substrate of the present invention has good heat conductivity, thermal resistance and smooth surface, whereby exfoliation of the film can be prevented. …<IMAGE>… </p> |
申请公布号 |
EP0221531(A2) |
申请公布日期 |
1987.05.13 |
申请号 |
EP19860115233 |
申请日期 |
1986.11.04 |
申请人 |
KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
YAMAMOTO, KENJI;NAKAYAMA, TAKEHISA;TAWADA, YOSHIHISA |
分类号 |
H01L21/48;H01L23/14;H01L23/373;H05K1/05 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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