发明名称 High heat conductive insulated substrate and method of manufacturing the same.
摘要 <p>A high heat conductive insulated substrate comprising a substrate of which heat conductivity is not less than 50 W/m.k, and a high heat conductive insulating layer coated on the substrate; and a method of producing a high heat conductive insulated substrate characterized in that an insulating layer is formed on a substrate by applying DC voltage and RF power to the substrate and providing magnetic field parallel to the surface of the substrate. …<??>The insulated substrate of the present invention has good heat conductivity, thermal resistance and smooth surface, whereby exfoliation of the film can be prevented. …<IMAGE>… </p>
申请公布号 EP0221531(A2) 申请公布日期 1987.05.13
申请号 EP19860115233 申请日期 1986.11.04
申请人 KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 YAMAMOTO, KENJI;NAKAYAMA, TAKEHISA;TAWADA, YOSHIHISA
分类号 H01L21/48;H01L23/14;H01L23/373;H05K1/05 主分类号 H01L21/48
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