发明名称 LEAD FRAME
摘要 PURPOSE:To improve inserting properties into a terminal hole by mutually connecting adjacent outer leads and connecting the outer leads and an outer frame by connecting members and forming the nose sections of the outer leads in a tapered manner. CONSTITUTION:Each outer lead 3 in a lead frame 1 and both an outer frame 2 and respective connecting member 9, 10 are separated after the lead frame 1 is fixed to a base 14 or after the completion of a package 13. Since the nose sections of the outer leads 3 connected to a transverse member 2a for the outer frame 2 are detached at the positions of the pointed ends of tapered sections 8 thereof at that time, the shapes of the noses of inserting sections 5 are formed in a tapered approximately isosceles triangle. Accordingly, when the DILG type IC 12 is mounted to a printed substrate, inserting work into terminal holes for the outer lead 3 is facilitated because the tapered sections 8 introduce the inserting sections 5 into the holes so as to guide the insertion.
申请公布号 JPS6298656(A) 申请公布日期 1987.05.08
申请号 JP19850237367 申请日期 1985.10.25
申请人 HITACHI LTD 发明人 YAMADA TOMIO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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