| 摘要 |
A low cost process for bonding a plurality of integrated circuit die to a variety of die support frames using existing, readily available equipment. Tape automatic bonding (TAB) processes offer a number of new possibilities in the assembly and packaging of integrated circuits. However, the investigation of TAB techniques or the use of TAB techniques on low volume parts is prohibited by the high cost of "bumping" or putting interconnection balls on the chip or the tape leads. The process permits placing balls on the bonding pads of a plurality of die by a wire bonder, cutting off the wire, planarizing the balls, coating the planarized region with a conductive epoxy and then registering and bonding the die to corresponding conductive patterns on die support frames.
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