Epoxy resin composition.

摘要

An epoxy resin composition comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by addition reaction between alkenyl group-containing epoxy resins and organopolysiloxanes of the following formula (1)
<Chemistry id="chema01" num="0001"><Image id="ia01" he="11" wi="84" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /></Chemistry>in which each R represents a substituted or unsubstituted monovalent hydrocarbon group, «a» is a value of from 0.01 to 0.1, «b» is a value of 1.8 to 2.2 and 1.81 < a + b < 2.3, and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; copolymers obtained by addition reaction between epoxy resins and amino group-containing organopolysiloxanes of the following formula (2)
<Chemistry id="chema02" num="0002"><Image id="ia02" he="12" wi="84" file="IMGA0002.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /></Chemistry>in which R' represents a divalent organic group, each R<Sup>2</Sup> represents a monovalent organic group, «a» is a value of from 0.01 to 0.1, «b» is a value of from 1.8 to 2.2 and 1.81 < a + b < 2.3, and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; and mixtures thereof.