| 摘要 |
PURPOSE:To linearly bond a lead frame or the like without lowering temperature by forming predetermined gas flow between position recognizing means and lead frame, semiconductor chip, preventing heat waves from occurring due to heating, eliminating contact of gas flow with bonding wire, thereby stably forming a ball. CONSTITUTION:Positions of a pellet 8 and a lead frame 9 are measured and recognized by a unit 4 to finely regulate the unit 4 and a capillary 2, and an optical axis of the unit 4 is placed directly on next bonding position. In this case, the gas flow of a nozzle 13 is fed under the unit 4 so as not to contact the end of a wire 11. Accordingly, it can prevent heat waves from occurring to recognize the accurate positions of the chip 8 and the frame 9, thereby eliminating the adverse influence to the formation of a ball 10. Then, the unit 4, a nozzle 13, a capillary 2, and an ultrasonic horn 1 are all moved at predetermined distance L, set directly above the bonding position to bond the wire 11 in a predetermined operation. The nozzle 13 injects oxidation preventive gas to prevent the frame from oxidizing and to heat the gas by a heater 15. Thus, the variation in temperatures do not occur in the frame 9 and the retainer 7. |
