RESIN-SEALED ELECTRONIC PART

摘要

PURPOSE:To augment mechanical protection for an electronic device and to improve its electrical characteristics by a method wherein it is sealed in a polyphenylene ether resin and polyphenylene sulfide resin composition containing an inorganic filler and, as required, some rubber. CONSTITUTION:A polyphenylene ether resin is added to a polyphenylene sulfide resin containing an inoganic filler. A copolymerized resin may be used instead of the polyphenylene sulfide resin, and its melt flow rate is to be preferably in the range of 500-10,000g/10 minutes. A proper rate is determined dependent upon the type of the electronic part. Out of polyphenylene ether resins, suitable for the purpose is a poly-(2.6-dimethy-1.4-phenylene) ether resin. Not only a mere polymer but also a copolymer will do. A styrene graft polyphenylene ether resin is especially good for the purpose. For a good result, against 100 parts in weight of the polyphenylene sulfide resin, the polyphenylene ether resin should occupy 0.1-30 parts in weight, provided the polyphenylene ether resin is composed only of polyphenylene ether polymer. Rubber may be added as required to the polyphenylene sulfide resin composite. Such a rubber addition is preferably to be 1-100 parts in weight against 100 parts in weight of a polymeric or copolymeric polyphenylene ether resin.