SEMICONDUCTOR PACKAGE USING CORE BALL AND MANUFACTURING METHOD THEREOF
摘要
<p>A semiconductor package and a manufacturing method thereof are provided to increase the distance between an upper package and a lower package by using a solder ball and a core ball. An upper package(200) includes a first semiconductor chip at an upper portion and a plurality of first connection balls(300) at a lower portion. A lower package(250) is stacked under the upper package. The lower package includes a second semiconductor chip and second connection balls(350) corresponding to the first connection balls. The first and second connection balls are selectively used as a core ball or a solder ball according to the arrangement between the first and second connection balls.</p>
