| 摘要 |
Field of multilayer substrates comprising a three-dimensional structure of printed circuits. A plurality of green ceramic wafers (plates), whose faces are equipped with intermediate conductive networks 12 and with interconnections 14 and whose upper face is equipped with external output connections 16, are subjected to firing. A plurality of contact pads 22 distributed at the places corresponding to the location of the connections 16 are made on the upper face, the surface of the pads being sufficiently large to ensure electrical contact whatever the dimensional variations occurring during firing. The upper face is coated with an insulating layer 28 having interruptions 30 uncovering a fraction of the pads 22, the conductive network 32 is made on the layer 28 and certain conductors are selectively connected to certain uncovered fractions of the pads 22. By compensating for the shrinkage which has occurred, this process makes possible the connection of equipment having a fixed pin spacing. <IMAGE> |
