| 摘要 |
PURPOSE:To reduce the size of the lens of an optical system and to reduce the thickness and size of an image pickup camera on the whole by using the image pickup camera consisting of an MOS solid-state image pickup element, the optical system in front of it, and a control circuit arranged at the periphery of the optical system. CONSTITUTION:The image pickup camera 1 is constituted by fixing an optical unit such as a lens and a printed board 14 where the MOS solid-state image pickup element is fitted in one body across a spring 15 with screws. The spring 15 holds the optical unit 13 and the MOS solid-state image pickup element on the printed board 14 at proper distance. An infrared-light emitting diode 18 for illumination is soldered to a printed board 17 arranged beside the optical unit 13 and this printed board 17 is also fixed to the optical unit 13 with a screw 16. When the MOS solid-state image pickup element is used, a control circuit can be arranged separately from the optical system and the control circuit is mounted on printed boards 24 and 24 arranged on both sides of the optical unit 13 for the purpose of the thickness reduction of the image pickup camera 1.
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