| 摘要 |
PURPOSE:To eradicate a trouble due to grasping failure by describing the orientation of a surface with a laser mark without providing a notched OF surface, keeping a wafer in a circular shape. CONSTITUTION:A dotted line 10 etched with a laser is made at the same position in place of an OF surface. The width of the mark line 10 is wide, the depth is sufficiently deep and the shape is so made that the shape is not erased even if the surface is processed by a wafer process. Then, the circular shape of a wafer is maintained as it is and a trouble of grasping failure at the time of handling in an automatic process is avoided. In the case of setting the surface orientation on the base line of the stage of an exposure equipment in a photo process, the position and the direction of the laser mark line 10 are read from the change of the waveform of an electric signal sent on the surface of the wafer and the surface orientation is set on the base line of the stage. Consequently, the positioning in the wafer process has no trouble even without the OF surface.
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