| 摘要 |
PURPOSE:To radiate heat from an electronic part chip in a highly efficient manner by a method wherein a part of the insulating layer on the surface of a printed wiring board is removed, and the electronic part chip is mounted on the part where the insulating layer is removed in the state that the chip comes in contact with a metal substrate. CONSTITUTION:An insulating layer 2 is adhered on the surface of a metal substrate 1, a circuit conductor 3 is provided on the surface of the insulating layer 2, and a printed wiring board 4 having a metal base is formed. At the position whereon the electronic part chip 5 such as a semiconductor chip and the like, a part of the insulating layer 2 on the surface of the printed wiring board 4 is removed by exfoliation, and the metal substrate 1 is exposed in the part where the insulating layer 2 is removed. Then, an electronic part chip 5 is mounted on the surface where the metal substrate 1 is exposed, the back side of the electronic part chip 5 is brought into contact with the metal substrate 1, and the electronic part chip 5 is mounted on the printed wiring board 4 by providing a wire bonding 17 and the like between the electronic part chip 5 and the circuit conductor 3. As the electronic part chip 5 is mounted on the exposed part, the heat of the electronic part chip 5 is transmitted to the metal substrate directly, and the heat is radiated in a highly effective manner. |
