| 摘要 |
PURPOSE:To facilitate the handling of a semiconductor laser vulnerable to electrostatic breakage and to obtain an inexpensive and lightweight device by forming a housing for housing an optical part with an electrically conductive plastic. CONSTITUTION:The housing of an optical pickup is formed with an electrically conductive plastic. Namely, since the housing 10 is provided with conductivity by the incorporated carbon, the handling of the semiconductor laser vulnerable to electrostatic breakage is facilitated and a shielding effect in reducing signal noise is also obtained by grounding the pickup with the housing 10. Furthermore, precision molding is possible, high precision can be obtained without precision machining and an light weight and inexpensive optical pickup can be obtained.
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