| 摘要 |
PURPOSE:To perform removal of defective chips in a part of product chips and replacement of good chips readily, by electrically connecting the bump electrode and the conducting pattern of a semiconductor chip through an anisotropic conducting film. CONSTITUTION:A bump electrode 14 is provided in a semiconductor chip 13. The electrode 14 is electrically connected to a conducting pattern 12 through a conducting part 16a of an anisotropic conducting film 16. The conducting film has conductivity in the direction of the film thickness and insulating property in both directions of the film. Then, the conducting film can be electrically connected at relatively low temperature by thermal compression. the connected part can be readily separated. Thus the removal of the defective chips in a part of the product chips and the replacement of the good chips can be readily performed. |
