| 摘要 |
PURPOSE:To easily and highly accurately manufacture a resin-molded part with a board imbedded in resin substrate by a method wherein the board is held by a spacer and a pressing pin in nthe state floated in a mold and, after that, resin is injected in the mold. CONSTITUTION:The manufacture of an IC card is taken for example; firstly, a printed wiring board 2 having IC modules 10 thereon is set in a mold in such a state that said board is held in the mold floated in the air by holding the end of said board 2 by a spacer 15 and a pressing pin 16. Secondly, an upper mold 11 is put on the mold 12 so as to inject resin in the molds 11 and 12 in order to mold a card substrate 13. Because the spacer 15 is made thicker than that of the IC modules 10, the board 2 is precisely and easily positioned and imbedded in the substrate 13. |
