发明名称 RESIN SEALED BODY
摘要 PURPOSE:To prevent a sealing resin from diffusing without increase in the cost by coating an ink mark in the prescribed thickness on the sealing region peripheral edge of a substrate. CONSTITUTION:An ink mark 5 is formed on the periphery of the sealing region of a sealing region 4 formed to surround an IC module 2. The mark 5 is formed by coating paint for preventing a precoating resin 4 from diffusing in the prescribed thickness in the printing step in case of forming printed wirings on an IC substrate. Thus, it can prevent the sealing resin of the resin 4 from increasing more than required to solder the parts such as resistors near the region. An exclusive step for forming the mark 5 is not necessary.
申请公布号 JPS61259551(A) 申请公布日期 1986.11.17
申请号 JP19850101794 申请日期 1985.05.13
申请人 RYODEN KASEI CO LTD;MITSUBISHI ELECTRIC CORP 发明人 TSUDA MASUMI;FUJITA SHIGEO;KOTAI SHOJIRO
分类号 B29C39/10;B29C39/22;B29L31/34;B32B27/00;H01L23/28;H01L23/544 主分类号 B29C39/10
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