发明名称 |
RESIN SEALED BODY |
摘要 |
PURPOSE:To prevent a sealing resin from diffusing without increase in the cost by coating an ink mark in the prescribed thickness on the sealing region peripheral edge of a substrate. CONSTITUTION:An ink mark 5 is formed on the periphery of the sealing region of a sealing region 4 formed to surround an IC module 2. The mark 5 is formed by coating paint for preventing a precoating resin 4 from diffusing in the prescribed thickness in the printing step in case of forming printed wirings on an IC substrate. Thus, it can prevent the sealing resin of the resin 4 from increasing more than required to solder the parts such as resistors near the region. An exclusive step for forming the mark 5 is not necessary. |
申请公布号 |
JPS61259551(A) |
申请公布日期 |
1986.11.17 |
申请号 |
JP19850101794 |
申请日期 |
1985.05.13 |
申请人 |
RYODEN KASEI CO LTD;MITSUBISHI ELECTRIC CORP |
发明人 |
TSUDA MASUMI;FUJITA SHIGEO;KOTAI SHOJIRO |
分类号 |
B29C39/10;B29C39/22;B29L31/34;B32B27/00;H01L23/28;H01L23/544 |
主分类号 |
B29C39/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|