| 摘要 |
PURPOSE:To reduce the cost of a wiring board and improve a mounting density by a method wherein a lead frame is plated and a circuit element is fixed to a tab, and the tab, the circuit element and parts of the leads are sealed with sealing resin and the lead frame is cut off. CONSTITUTION:An electronic part 7 is composed of a cuboid sealing part 8 and a plurality of leads 9 which are extended from the sides of the sealing part 8 and bent downward at their intermediate portions. The tips of the leads 9 extended downward touch the upper surface of a wiring board 10 and these touching parts are fixed with solder, welding material, to fix the electronic part 7 to the wiring board 10. Outside ends of the leads 9 in a lead frame 12 are separated from the framework 13 in the manufacturing process of the lead frame and, in this condition, the whole lead frame is plated with silver. After a circuit element 15 is fixed on a tab 14, electrodes of the circuit element 15 are connected to the inner ends of the leads 9 with wires 16. Then the portion inside a dam 17 is molded with resin and the unnecessary dam 17 and framework 13 are cut off and removed. With this constitution, the cost of the wiring board can be reduced and the mounting density can be improved. |
