| 摘要 |
PURPOSE:To lift off a thin film coated simply and positively by forming a window only on the inside except the fringe section of one main surface of the wafer and coating the residual section of the wafer. CONSTITUTION:An inverted taper type section pattern of photo-resists 22 as the spacers of a lift-off process is formed onto the wafer 21. A wafer encasing plate 231 and a hold-down plate 222 encase the wafer 21, and are clamped by bolts 24 and nuts 25 as shown in the figure (b). Accordingly, the wafer 21 is supported to a support jig 23, which has a window in the surface, which must coat the thin film, and completely cover the fringe, side surrfaces and the back, and set up to a vacuum deposition device, and a metallic film 26 as electrodes and wiring is coated and formed. The figure (a) shows a state in which the support jig 23 is removed, and the unnecessary metallic film is lifted off together with the photo- resists 22 when the wafer under the state is entered into a photo-resist exfoliating liquid, and electrodes required and a wiring pattern are formed. |
