发明名称 APPARATUS FOR PRESSURE MOLDING OF CURED PLATE
摘要 PURPOSE:To enhance working efficiency by easily and safely demolding a pressure-molded plate without damaging the same, by a method wherein a flexible film material is superposed to a pressure mold along the pressure surface thereof to be closely contacted therewith at the time of molding and pressure is applied to the back surface of the flexible film material at the time of demolding to protrude and deform the film material with respect to the surface of the pressure-molded plate. CONSTITUTION:A material plate (a) is fed in a state placed on a movable mold plate 3 to reach under a pressure mold 2 and a fluid passage is reduced in pressure by communicating a fluid introducing pipe 13 with a suction source to closely contact a flexible film material 11 with the molding surface of the pressure mold 2 under suction and, in this state, the pressure mold 2 is downwardly moved to perform the pressure molding of the material plate (a) between the pressure mold 2 and a receiving mold 1 under pressure. After molding work was finished, if a fluid is fed in the fluid flow passage under pressure in synchronous relation to the upward movement of the pressure mold 2 from the receiving mold 1, the film material 11 is protruded and deformed by the pressure of the fluid applied to the back surface of the flexible film material 11 through a through-hole 12 to be formed into a shape different from the surface shape of the molded material plate (a) and, therefore, the material plate (a) is partially pressed downwardly to collapse the close contact relation between the film material 11 and the material plate (a) and the material plate (a) and the movable mold plate 3 are demolded from the pressure mold 2 under their own wts.
申请公布号 JPS61255818(A) 申请公布日期 1986.11.13
申请号 JP19850098017 申请日期 1985.05.10
申请人 FUJI SEISAKUSHO:KK 发明人 SAITO TSUTOMU;HOSAKA YUKIO
分类号 B28B1/52;B28B3/02;B28B11/10;B29C33/46;B29C43/36;B29C43/50;D04H1/587;D21J3/00 主分类号 B28B1/52
代理机构 代理人
主权项
地址
您可能感兴趣的专利