THIN FILM HYBRID CIRCUIT

摘要

1. Process for manufacturing a thin-film hybrid circuit having contact areas for external connections and/or components, characterized in that : a) a thin-film circuit including conductor tracks (3) and contact areas (4, 5) is completely vapour-deposited or sputtered through masks onto a substrate (1) coated with a base oxide (2), b) an inorganic protective layer (6) is uniformly vapour-deposited or spluttered onto the thin-film circuit for the purpose of passivation in the same vacuum process, c) the circuit is annealed in air, d) a photoresist layer (7) is deposited and photolithographically laid bare at the contact areas (4, 5), e) the photoresist layer (7) is cured, f) the inorganic protective layer (6) is etched away at the site of the contact areas (4, 5).