HIGH-SPEED INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE:To realize an IC package capable of excellent propagation of high- speed signals by a method wherein wirings connected to an IC chip are made long and the width of the airtight sealing portion is made smaller than that of an inner or outer wiring for the establishment of characteristic impedance matching with the wirings and the airtight sealing portion. CONSTITUTION:An IC chip 6 is placed on an insulating substrate 2 provided with a metal film 4 on its lower surface and is connected to a wiring 1 by a wire 7, and then airtight junction is established between a metal cap 5 and the periphery of the substrate 2 with the intermediary of an insulating member 3. The width Wb of the sealed wiring portion 1b of the wiring 1 of the equilibrium-type strip line structure is made smaller than the width Wa of the inner wiring 1a of the micro strip line structure. The width is determined in response to the thickness and dielectric coefficient of the substrate 2 and insulating member 3 so that characteristics impedance matching may be attained. The change in the width Wa or Wb may be gradual. Matching may be established with the characteristic impedance of an outer terminal 1c.